Welcome to ITC

Integrated Technology Corporation has been serving the needs of our customers for more than 35 years.


We provide solutions for metrology and testing equipment in many areas:

 
  • Test, analysis, and repair of IC probe cards
  • Innovative metrology and inspection solutions
  • Solutions for dynamic testing of power semiconductors
 

Whats New at ITC

Press Release - ITC v Rudolph Technologies - Final Judgement Issued

ITC announced that Senior United States District Judge, Roslyn O. Silver has issued the final judgment in the patent infringement suit between Integrated Technology and Rudolph Technologies, Inc.   
 
On February 6th, 2014 Judge Silver for the District of Arizona ordered that ITC is entitled to damages from Rudolph Technologies in the amount of $7,684,047 and pre-judgment interest on these damages of $2,893,646. Judge Silver ruled that pre-August 2007 PRVX, PRVX2 and PRVX3 systems infringed ITC's U.S. Patent No. 6,118,894.
 
Rudolph Technologies' claim for declaration of non-infringement of the '894 patent and claim for declaration that the '894 patent is invalid were both dismissed with prejudice. The United States Court of Appeals for the Federal Circuit also remanded the issue of attorney's fees to Judge Silver's court.

Read the full Press Release

ITC has designed, built and shipped its first ProbiltTM motherboard for the Teradyne towerless probe card interface.

Teradyne towerless motherboard cropped small 

The ITC75100 enhanced capability UIL tester has recently started shipping to customers.  In addition to avalanche testing of power semiconductor devices, this system can also provide Rdson, Vdson and thermal measurements.

ITC75100 cropped 1

 

Product Highlight

ITC55100C Crowbar (Patent Pending)

This option for the ITC55100C UIL tester provides a parallel energy path that in the event of an avalanche failure takes the energy away from the device under test. In a wafer probe application it provides protection for the probe card and the device under test, stops debris scatter across the wafer and prevents the avalanche failure from impacting adjacent die.