ITC55100
Model ITC55100 is the industry standard test system for avalanche testing of Power MOSFETs, IGBT's and Diodes. Peak current can be set as high as 200A, and breakdown voltages up to 2500V can be handled. As standard the ITC55100 is configured with two test ports so as well as testing a single device, it can also test dual N-channel, dual P-channel or a combo N and P channel package. Tests performed conform to MIL-STD-750D Method 3470 which defines how to test the ruggedness of MOSFETs and IGBT's by stressing them to controlled energy levels.

ITC55300
Model ITC55300 is a higher current (400A) version of the ITC55100 tester. The ITC55300 performs the same tests as the ITC55100 and includes the same features that improve testing accuracy, test results collection, test results viewing, and multiple tester networking. The ITC55300 also has the added capability of testing dual devices; N-channel, P-channel or combination.

Like the Model ITC55100 the Model ITC55300 performs ruggedness testing of power MOSFETs, discretes and modules and IGBTs, discretes and modules. It also tests single and dual diodes, and forward and reverse bias of IGBTs when used with an optional ITC55-RSF Output Selector Box.

ITC55400
Model ITC55400 is the high current (800A) version of the ITC55100 tester. The ITC55400 performs the same tests as the ITC55100 and includes the same features that improve testing accuracy, test results collection, test results viewing, and multiple tester networking. The ITC55400 is configured with a single test port for testing individual high current devices.

Model ITC55400 performs ruggedness testing of power MOSFETs, discretes and modules and IGBTs, discretes and modules. It also tests single and dual diodes, and forward and reverse bias of IGBTs when used with an optional ITC55-RSF Output Selector Box.

ITC55WPS

ITC has developed a unique patent-pending product line that makes it possible to fully test high-voltage, high-current power semiconductor devices at the chip and wafer level using a probe card. These systems can be built up in modular form with four different configurations designed to meet the needs of semiconductor manufacuters from small volume, custom hybrid manufacturers to high volume, single product manufacturing.

ITC Wafer Probe Systems can adapt ITC package-level testers for wafer-level and die-level testing.