In response to the semiconductor industry's need to perform comprehensive power semiconductor testing at the chip and wafer level, ITC has developed a unique patent-pending product line that makes it possible to fully test these high-voltage, high current devices using a probe card.

ITC has developed a series of ITC WPS (Wafer Probe Systems) that can be built up in modular form. These 4 modules were designed to meet the needs of semiconductor manufacuters from small volume, custom hybrid manufacturers to high volume, single product manufacturing.

ITC Wafer Probe Systems can adapt ITC package-level testers for wafer-level and die-level testing.

• Up to 160 current limit channels per ITC55WPS1000
• Protects probe card and DUT from over current
• Programmable current limit for each probe on the probe card
• Cres check on every probe with ITC55WPS1002
• Avalanche testing on wafer or chip at 200A
• RdsON/VceON tests available with ITC55WPS1003 on chip or wafer
• Inductive switching on chip with ITC55WPS1003
• Resistive switching on chip with ITC55WPS1004

• Avalanche
• RBSOA
• Inductive Switching
• Resistive Switching
• VceON
• RdsON