As with any process used in the manufacturing and testing of wafers, certain procedures should always be followed to insure proper yield and quality of probe cards. Clean probe cards are necessary for repeatable and reliable testing of leakage, contact resistance, planarity, wire check and in some cases alignment. Contaminants can change results of alignment and probe diameter tests by varying amounts.
ITC recommends using an ultrasonic bath. The advantages are:
- no physical contact with the probes,
- leakage is significantly reduced,
- cracks in the tips are exposed for detection, and
- ultrasonic cleaning tends to reduce contact resistance problems on a more long-term basis.
- Setup ultrasonic tank with de-ionized water and a small amount of mild cleaning agent* (alcohol is not recommended due to residue)
- Immerse probe card for 15 minutes. Monitor results over time and increase or decrease submersion time as necessary.
- Thoroughly rinse card with de-ionized water.
- Blow dry with "clean" air or nitrogen.
- Place into oven at 50?C for 15 minutes or until completely dry.
We have found, through tests performed at ITC and at our customers? sites, that the above process will significantly improve the reliability of your probe cards during use and of the test results found on the Probilt Probe Card Analyzer.
* The cleaning agent we recommend is called "Micro".
International Products Corporation
P.O. Box 70, Burlington
Phone: (609) 386-8770
If you have any questions, please contact ITC's Application Engineering Department
Procedure developed by Gary Aalseth with help from ITC's Application Engineering Department.