Abstract submitted to IEEE Southwest Test Workshop 2008

"Practical Considerations for Full Power Avalanche Testing of Power Semiconductor Wafers and Die"

As the capabilities of power semiconductors have increased, so have testing requirements to insure that Known Good Die (KGD) are used in power modules and other integrated assemblies. In order to test power semiconductor dice up to power levels that insure known good die certification, significant test capability and methods must be utilized during wafer/dice probing. Furthermore, the test methods involving the "probecard interface" should be traceable and directly related to industry standard power semiconductor test specifications such as MIL-STD-750C Methods 3470, 3471, 3472, and 3473.

In particular, Avalanche testing, also known as Method 3470, will be presented in detail with direct application to probecard die testing at power levels up to device failure. Test data and waveforms from multiple devices that delineate test and process issues while performing Avalanche tests will be shown. Test software will be included along with applicable flowcharts and test strategies. Finally, design techniques will be detailed to show how to protect probecards and other test equipment in the event of destructive device-under-test failures.

This information will be most valuable to semiconductor manufacturers, power semiconductor design engineers, test system software engineers, characterization engineers, and those involved with certifying KGD.

Authors and Presenters:

Steven T. Clauter, Test Equipment Design Engineer
Integrated Technology Corporation
1228 N. Stadem Drive Tempe, AZ 85281
USA
480-968-3459 x328
480-968-3099 FAX
stevec@inttechcorp.com
www.inttechcorp.com

Taichi Ukai, President and CEO
Tiatech, Incorporated
2-19-12 Kojima, Taito-Ku
Tokyo, 111-0056
Japan
+81-3-5823-5323
+81-3-5823-5324 FAX
ukai@tiatech.com
www.tiatech.com

About ITC
Integrated Technology Corporation (ITC) has been serving the needs of our customers for more than 30 years. ITC is a world leader in probe card metrology and repair tools as well as equipment for dynamic testing of power semiconductor devices. Our equipment is recognized around the world for providing leading edge test capability and extremely high reliability. We are dedicated to serving our customers with the best solutions possible. ITC is constantly committing a major portion of its effort to developments that enhance the state of the art in its field. The manufacturing capability is vertically integrated, with a fully equipped machine shop using automated machining centers, CAD for electrical and mechanical design and a complete electronic circuit board manufacturing and testing capability. This guarantees our customers the best delivery, quality and support. ITC also maintains a worldwide staff of service and training personnel to insure customer support.