September 26, 2006 Tempe, AZ - Power semiconductor test equipment supplier Integrated Technology Corporation (ITC), announced that its ITC55100 tester has been selected by one of the industry's leading providers of design-to-test solutions for the global semiconductor industry, to integrate into one of their high throughput, small footprint, linear and mixed-signal IC test systems. To date ITC shipped has shipped more than 20 of their ITC55100 systems to this customer.
The ITC55100 has been fully integrated into the customer's test platform and adds the Unclamped Inductive Switching (UIS) test to the system. The addition of the UIS test will help the customer meet the needs of a wider customer base.
According to Mark McLaren, Director of Sales and Marketing for ITC, "This is a wonderful opportunity for ITC to further enhance its position as the number one supplier of avalanche test equipment to power semiconductor manufacturers, and we are especially pleased to be able to do this in partnership with a major player in the semiconductor test arena".
About ITC
Integrated Technology Corporation (ITC) has been serving the needs of our customers for more than 30 years. ITC is a world leader in probe card metrology and repair tools as well as equipment for dynamic testing of power semiconductor devices. Our equipment is recognized around the world for providing leading edge test capability and extremely high reliability. We are dedicated to serving our customers with the best solutions possible. ITC is constantly committing a major portion of its effort to developments that enhance the state of the art in its field. The manufacturing capability is vertically integrated, with a fully equipped machine shop using automated machining centers, CAD for electrical and mechanical design and a complete electronic circuit board manufacturing and testing capability. This guarantees our customers the best delivery, quality and support. ITC also maintains a worldwide staff of service and training personnel to insure customer support.
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